RF & Microwave
Teledyne Reynolds UK RF & Microwave products and interconnect solutions support high-frequency signal integrity in demanding aerospace,
defence and high-reliability industrial applications. These solutions are selected where controlled impedance, low loss, stable performance over temperature,
and robust mechanical construction are essential—particularly in environments exposed to vibration, shock, humidity and wide thermal cycling.
At RF and microwave frequencies, the interconnect becomes part of the circuit. Connector geometry, dielectric materials, screening strategy, cable construction,
and termination workmanship all influence insertion loss, return loss, shielding effectiveness and long-term stability. Reynolds UK focuses on delivering
repeatable, programme-ready performance through careful design control and disciplined manufacturing processes, helping reduce integration risk and simplifying
qualification for mission-critical systems.
Whether the requirement is a rugged RF cable assembly, a high-frequency connector interface, or an integrated interconnect solution for a subsystem,
selection typically starts with electrical performance targets (frequency range, impedance, loss and VSWR/return loss), then validates environmental durability,
mechanical constraints and compliance documentation needs.
Where RF & Microwave solutions are used
- Radar and EW: front-end interconnect, receiver/transmitter routing, timing and synchronisation paths
- Communications: SATCOM, data links, line-of-sight radios and high-frequency networking
- Guidance and avionics: antenna feed lines, RF distribution and subsystem interconnect
- Test and instrumentation: calibrated RF paths, lab systems and production test fixtures
- High-reliability platforms: ruggedised enclosures requiring stable RF performance over life
Key benefits
- Signal integrity focused: controlled impedance and stable performance across the operating envelope
- Lower integration risk: disciplined termination and assembly processes for repeatability
- Harsh-environment durability: constructions suited to vibration, shock and temperature cycling
- Support for programme needs: documentation, traceability and qualification-friendly delivery
- System-level thinking: connectors, cable and grounding considered together
Selection guidance
RF & microwave performance is usually defined by a small set of “make-or-break” requirements. Sharing these early enables faster selection and fewer
redesigns during test and qualification.
- Frequency range: operating band(s), harmonics and any wideband requirements
- Impedance: typically 50 Ω or 75 Ω, plus tolerance expectations
- Loss and match: insertion loss, return loss/VSWR targets, and allowable ripple
- Power handling: average and peak power, duty cycle and thermal conditions
- Shielding and grounding: EMI/EMC needs, screen termination approach, chassis bonding
- Mechanical constraints: bend radius, routing, connector interface, mating cycles and service access
- Environment: temperature range, vibration/shock, humidity/contamination, altitude
Integration tips
Many RF issues trace back to routing and termination details: tight bend radii, inconsistent screen termination, poor strain relief, or unintended grounding paths.
For best results, keep RF paths consistent, avoid sharp bends, control connector torque and maintain cleanliness during assembly to protect dielectric interfaces.
Related links:
Reynolds UK products
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Reynolds UK overview
Frequently Asked Questions
1) What does “RF & Microwave” cover?
RF typically refers to radio-frequency design broadly, while microwave generally covers higher-frequency ranges where interconnect geometry and materials
have a stronger effect on signal behaviour. In both cases, connector and cable performance directly impacts system-level results.
2) What information do you need to recommend an RF cable assembly or connector?
Frequency range, impedance (50 Ω/75 Ω), insertion loss and return loss/VSWR targets, power levels (average and peak), environment (temperature, vibration/shock,
humidity/contamination, altitude), routing constraints (length, bend radius), connector interface preferences, and any screening/grounding requirements.
3) Why is controlled impedance important?
Controlled impedance helps prevent reflections that degrade match and increase standing waves, which can reduce power transfer and distort signals.
It’s particularly important at higher frequencies and in wideband systems.
4) What’s the difference between insertion loss and return loss?
Insertion loss describes how much signal is attenuated through the interconnect. Return loss (often expressed via VSWR) describes how well the interconnect
is matched—how much signal reflects back due to impedance discontinuities.
5) Do vibration and temperature cycling really affect RF performance?
Yes. Mechanical stress can change cable geometry or connector interfaces, and temperature can shift dielectric behaviour. These effects can alter loss and match,
so harsh-environment programmes often require designs that remain stable across the full operating envelope.
6) How should screening and grounding be handled for RF systems?
The best approach depends on the system EMI/EMC strategy. In general, maintain consistent screen termination, minimise pigtails where practical, and align chassis
bonding with the platform grounding scheme to avoid unintended return paths or noise coupling.
7) What are common causes of poor RF performance in the field?
Tight bend radii, damaged dielectric, inconsistent connector torque, contaminated interfaces, incomplete screen termination, and strain relief issues are frequent
contributors. Many problems are preventable with disciplined installation and handling practices.
8) Can you support programme documentation and qualification needs?
Yes. If you share your programme requirements (traceability, inspection, test evidence, configuration control), we can align the recommended solution and delivery
package to support qualification and long-term sustainment.
