DLA-accredited MIL-PRF-38534 Class H and Class G hybrid manufacturing with full quality assurance provisions

Thick-film substrate fabrication on Al2O3, BeO, and AlN with diffusion patterning, resistor networks, and multi-layer capability

Thin-film substrate capability with Ti-W, Au, Ni, NiCr, and TaN metallization using thermal evaporation and sputter deposition

Void-free eutectic die attach and fully automatic pick and place for active and passive chip integration

Manual and automatic wire bonding using K&S, Hughes/Palomar, Delvotec, and Orthodyne equipment

Environmental stress screening: temperature cycle, centrifuge, PIND, fine and gross leak test, laser trim, and fully automated electrical test -- 100% of production

Hermetic sealing provides moisture and contamination protection that printed circuit assembly cannot match in space and military operating environments

Al2O3, AlN, and BeO substrates deliver superior thermal conductivity versus standard PCB materials, eliminating hotspots that degrade component life in high-power applications

Fewer solder joints than PCA increases fundamental reliability -- critical in high-vibration defense and space environments where solder joint fatigue is a common failure mode

DLA Class H qualification provides a government-recognized, auditable quality baseline accepted across all US defense and space program procurement requirements

No sub-tier suppliers: every step from substrate to sealed package is controlled in-house, eliminating supply chain schedule risk for programs with aggressive timelines

Unpackaged dies are dramatically smaller and lighter than their packaged equivalents -- enabling SWaP-optimized hybrid designs where printed circuit assemblies cannot compete

Solid-state power controllers for space vehicles and defense platforms requiring hermetically sealed hybrid assemblies with MIL-PRF-38534 Class H screening

Radar receivers and stores management systems deployed on ground and aerial defense platforms requiring hermetic, high-vibration-resistant assemblies

DC-DC converters and high-current drivers for satellite payload electronics requiring compact, light, hermetically protected hybrid packages

Deflection amplifier and activator control hybrids for precision guidance and actuation applications on defense platforms

Digital-analog converters and signal processing hybrids where hermetic protection and wide operating temperature range are mission requirements

Custom multi-layer thick-film or thin-film substrate assemblies requiring integrated passive networks with precision laser-trimmed resistors

Quality certification: DLA MIL-PRF-38534 Class H (standard military) and Class G (QML) -- government-certified and renewable

Substrate materials: Al2O3, BeO, AlN for both thick-film and thin-film metallization systems

Thick-film metallization: Au/Ag on Al2O3, BeO, AlN; diffusion patterning; resistor networks; multi-layer capability

Thin-film metallization: Ti-W, Au, Ni, NiCr, TaN; thermal evaporation; sputter deposition; additive and etch-back processes

Hermetic sealing: Projection weld and seam seal; leak test per MIL-STD-202 Method 112 (gross) and MIL-STD-883 Method 1014 (fine)

Environmental stress screening: 100% temperature cycle, centrifuge, PIND, fine and gross leak, laser trim, automated electrical test per MIL-PRF-38534