Services

  • Environmental screening to MIL-PRF-19500, MIL-PRF-38534, MIL-PRF-38535, MIL-STD-883, and MIL-STD-750

  • Lot Acceptance Testing on die and packaged devices including transistors, diodes, and MMICs

  • DC and RF electrical testing from 100 kHz to 40 GHz; CW power test to 200 Watts

  • Chip and wire assembly from single die through complex hybrids; hermetic sealing available

  • Die services: visual inspection, sorting, waffle and gel pack packaging, and ESD testing

  • Build-to-print assembly for passive and active components; custom screening procedures available

Screening Tests

  • Internal visual (assemblies and assembled components)

  • Stabilization bake and temperature cycle (-65 to +150 degrees C available)

  • Constant acceleration and PIND (particle impact noise detection)

  • HTRB (high temperature reverse bias) and burn-in / life test

  • Fine and gross seal test; radiographic inspection; external visual

  • Bond pull / die shear; solderability; lead integrity; SEM (scanning electron microscope)

Programs

  • Raytheon — Patriot missile defense and classified programs

  • General Dynamics — defense electronics and space programs

  • Lockheed — aerospace and satellite programs

  • BAE and EADS — Euro Fighter and defense avionics

  • Space Systems Loral and L3-Narda West — space and communications programs

  • GPS, classified space, medical, and industrial program support

Compliance

  • Certification: MIL-PRF-38534 Classes H and K with TRB Option; ISO 9001; AS9100C

  • Screening Standards: MIL-PRF-19500, MIL-PRF-38534, MIL-PRF-38535 Groups A-E

  • Environmental Test Lab: Full MIL-STD-750 and MIL-STD-883 certified laboratory

  • ESD Testing: Human Body Model (HBM) and Machine Model (MM) per ESDA, JEDEC, MIL-STD-883 Method 3015

  • RF Test Range: DC and 100 kHz to 40 GHz; CW power to 200 Watts

  • Die Evaluation: 100% visual inspection and LAT for space and military applications​