Integrated Microwave Assemblies

Question 1

Answer

An integrated microwave assembly combines multiple microwave components — amplifiers, mixers, filters, switches, and control circuitry — into a single qualified subsystem that performs a defined signal processing function.
IMAs reduce program schedule and cost by eliminating the interface design burden between discrete components and delivering a tested, specification-compliant assembly ready for system integration.
Teledyne RF and Microwave designs IMAs for radar, EW, satellite communications, and space applications.

Question 2

Answer

Supported configurations include hybrid microcircuit, MMIC, and mixed hybrid-MMIC designs depending on frequency, power, and performance requirements.
Specific assembly types include I/Q demodulators, coupled detector assemblies, switched amplifier detector assemblies, downconverters, dual-band VCOs, and VME modules.
Analog and mixed analog-digital designs are available, incorporating both microwave circuit and digital control board functionality.

Question 3

Answer

The component and subsystem engineering teams work directly with the customer's design team to identify the correct integrated subassembly for the system requirements.
In-house microwave modules are assembled on thin film circuits and wire bonded into a complete microwave chain, with power and control boards integrated around the microwave core.
The assembly is then tested using full DC and RF test capability to 40 GHz at ambient through full military temperature extremes.

Question 4

Answer

The depth of the in-house module library means most new IMA designs can be assembled from proven building blocks, dramatically reducing design risk and cycle time compared to starting from scratch.
Using common modules across multiple programs also improves supply chain reliability and allows faster response to engineering change requests.
The module concept is central to Teledyne RF and Microwave's design philosophy and has been refined over more than 40 years of defense and space program experience.

Question 5

Answer

The broadband downconverter covers RF inputs from 1.85 to 9.35 GHz, converting to IF from 0.75 to 1.25 GHz, with a 10 dB nominal conversion gain and 7 dB typical noise figure.
Output P1dB is +6 dBm minimum, and a 5-bit digital attenuator provides 15.5 dB of gain control range with 0.5 dB LSB resolution.
High L-to-I and R-to-I isolation is achieved through an output filter centered at 1 GHz with 500 MHz bandwidth.

Question 6

Answer

The six-channel 2 to 18 GHz downconverter provides channel-to-channel amplitude match of approximately 1.0 dB and phase match of less than 20 degrees — critical for direction finding and multi-aperture radar.
The assembly uses a single LO input at -6 dBm, with each channel integrating a range extension switch adding 20 dB of dynamic range.
Noise figure is approximately 13.5 dB and output IP3 is approximately +25 dBm.

Question 7

Answer

Yes. VME RF protection and distribution modules cover 30 to 3000 MHz with on-board PIC controller circuitry.
Protection modules operate in six sub-bands and handle inputs up to 2 Watts CW while selecting attenuation to maintain operability in harsh signal environments.
Distribution modules are available in 8-output or 16-output configurations with power monitoring and transfer switching for test signal injection.

Question 8

Answer

Yes. All integrated microwave assemblies can be designed to customer-specified requirements including frequency plan, IF output, gain, noise figure, power handling, and environmental screening level.
The modular approach and existing module library allow frequency plans to be modified with minimal redesign for program-specific requirements.
Engineering support is available from specification development through qualification and production.

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