Wafer bank inventory of hard-to-find and obsolete ICs acquired from manufacturers exiting the semiconductor market

Die repackaging services placing existing die into new hermetic or plastic packages appropriate to the application

Interposer fabrication creating footprint-compatible adapters to fit replacement parts into legacy PCB layouts

Ground-up IC resurrection including redesign and new wafer fabrication for beyond end-of-life programs

Customer-furnished wafer and packaged device qualification and test services

DOD DMEA Trusted Supplier facility with over 50 years of microelectronics assembly experience in Lewisburg, Tennessee

Platform extension keeps defense and space systems operational without requiring full system or PCB redesign

Wafer bank inventory provides immediate supply relief for programs facing critical legacy component shortages

Interposer solutions allow form-fit-function replacement using available die without PCB layout changes

IC resurrection eliminates dependence on any single commercial supplier by enabling direct manufacturing of the part

DOD DMEA Trusted Supplier status provides procurement documentation and traceability for defense programs

Over 50 years of assembly experience at the Lewisburg facility provides confidence in platform extension solution quality

Defense avionics, radar, and weapons system platforms requiring sustained supply of legacy ICs beyond original manufacturer end-of-life

Satellite and spacecraft programs dependent on specific IC types no longer commercially available

Military vehicle and ground systems electronics facing component obsolescence in long-running sustainment contracts

Launch vehicle avionics programs requiring footprint-compatible replacements for obsolete control and processing ICs

Nuclear and industrial control systems requiring long-service-life component supply with documented qualification traceability

Ground support equipment programs requiring exact or footprint-compatible replacements for obsolete custom ICs

Service types: Wafer bank sourcing, die repackaging, interposer fabrication, IC resurrection, customer device qualification and test

Assembly capabilities: Flip chip, wire bonding, underfill, die stacking — Lewisburg, Tennessee facility

Facility qualification: DOD DMEA Trusted Supplier; MIL-PRF-38534 Class H hybrid assembly capability

Experience: Over 50 years of microelectronics assembly for military programs at Lewisburg, Tennessee

Packaging: Hermetic ceramic, plastic encapsulated, and custom footprint-compatible formats available

Certifications: AS9100C, ISO 9001:2015, ITAR Registered, DOD DMEA Trusted Supplier​​