FAQ
What is a Platform Extension Module and who needs it?
• A Platform Extension Module is a replacement or equivalent IC solution maintaining supply continuity for a defense or space platform when the original component is no longer available.
• Defense programs with 20-40 year operational lifetimes frequently encounter this situation as commercial semiconductor manufacturers discontinue older device families.
• Services range from wafer bank inventory to complete IC resurrection.
What is the Teledyne HiRel wafer bank?
• Teledyne HiRel maintains an extensive wafer bank of hard-to-find and obsolete ICs acquired from manufacturers that have exited the semiconductor market.
• As semiconductor companies gradually exit markets, Teledyne HiRel buys their legacy inventory and carefully stores it for future supply.
• The wafer bank covers analog, logic, interface, memory, and other digital IC categories.
What is die repackaging and when is it used?
• Die repackaging takes existing die from wafer bank or customer-furnished inventory and assembles them into new packages appropriate to the application.
• Used when the original package is no longer suitable or available.
• The repackaged device undergoes qualification and screening appropriate to program requirements.
What is an interposer and how does it solve footprint compatibility problems?
• An interposer is an electrical adapter substrate that converts the pinout and footprint of a replacement IC to match the original device's PCB land pattern.
• Interposers allow a replacement IC with a different package or pinout to be used without any board layout changes.
• Teledyne HiRel designs and fabricates custom interposers as part of its platform extension services.
What does ground-up IC resurrection involve?
• IC resurrection begins with reverse engineering the functionality from available documentation, sample devices, and test data.
• The functionality is redesigned using available wafer fabrication processes compatible with required performance.
• New wafers are fabricated, die are packaged in the appropriate format, and the resurrected IC is qualified to program requirements.
What qualification is available for platform extension solutions?
• Repackaged and resurrected ICs can be qualified to MIL-PRF-38534 Class H, MIL-PRF-38535 Class B/Q/V, and MIL-STD-883.
• Customer-furnished wafers and packaged devices can be brought into the Teledyne HiRel qualification and test flow.
• Custom SCD flows are developed to meet program-specific reliability and screening requirements.
What types of ICs can Teledyne HiRel resurrect or source through the wafer bank?
• Wafer bank covers analog ICs (op-amps, comparators, voltage regulators), interface ICs (bus transceivers, line drivers), logic (standard logic, CMOS, bipolar), and memory (SRAM, PROM, FIFO, CBRAM, DDR).
• IC resurrection can address a broader range depending on design complexity and wafer fabrication process availability.
• Contact the Teledyne HiRel applications team with specific part numbers to discuss availability and solution paths.
Why does DOD DMEA Trusted Supplier status matter for platform extension programs?
• The DMEA Trusted Supplier designation is granted to manufacturers meeting strict security and process requirements for handling sensitive defense microelectronics.
• For programs with counterfeit detection and supply chain security requirements, Trusted Supplier status provides documented assurance of part authenticity and manufacturing traceability.
• This is particularly important for platform extension parts replacing obsolete devices where original manufacturer documentation may be limited.
