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Features

  • Memory types include SRAM, PROM, CBRAM, DDR, FIFO, and multi-chip memory modules (MCM)

  • Wafer bank inventory of hard-to-find and legacy memory ICs from manufacturers that have exited the market

  • Qualification to MIL-PRF-38535 Class B and Q and MIL-STD-883 for defense program compliance

  • Custom SCD qualification flows available for program-specific screening requirements

  • Hermetic ceramic packaging for high-reliability environmental protection

  • Platform extension services including die repackaging, interposer fabrication, and IC resurrection

Benefits

  • Wafer bank supply assurance protects long-running programs from memory IC supply disruption when original sources exit the market

  • Broad memory type coverage reduces the number of qualified suppliers needed across a system memory bill of materials

  • QML qualification provides the traceability and process documentation defense programs require

  • Custom SCD screening allows reliability assurance to be balanced with program cost and schedule

  • Platform extension services provide supply paths for legacy memory types beyond commercial end-of-life

  • DOD DMEA Trusted Supplier status provides procurement confidence for defense program memory sourcing

Applications

  • Defense avionics and guidance systems dependent on specific qualified memory types for long platform lifetimes

  • Radar and electronic warfare signal processors requiring high-reliability SRAM and FIFO buffer memory

  • Launch vehicle guidance and control systems requiring qualified, hermetically packaged memory devices

  • Military platform sustainment programs requiring legacy memory IC supply through wafer bank inventory

  • Ground-based defense and command systems requiring long-service-life qualified memory components

  • High-reliability industrial applications requiring long-duration qualified memory with documented traceability

Specifications

  • Memory types: SRAM, PROM, CBRAM, DDR, FIFO, MCM (multi-chip memory module)

  • Qualification levels: MIL-PRF-38535 Class B/Q, MIL-STD-883; custom SCD available

  • Packaging: Hermetic ceramic; plastic encapsulated; bare die and MCM formats available

  • Supply model: Standard catalog, wafer bank inventory, and platform extension sourcing

  • Platform extension: Die repackaging, interposer fabrication, and IC resurrection for legacy devices

  • Certifications: AS9100C, ISO 9001:2015, ITAR Registered, DOD DMEA Trusted Supplier​

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