Teledyne HiRel | Aerospace & Defense Memory Solutions

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Features

Memory types include SRAM, PROM, CBRAM, DDR, FIFO, and multi-chip memory modules (MCM)
Wafer bank inventory of hard-to-find and legacy memory ICs from manufacturers that have exited the market
Qualification to MIL-PRF-38535 Class B and Q and MIL-STD-883 for defense program compliance
Custom SCD qualification flows available for program-specific screening requirements
Hermetic ceramic packaging for high-reliability environmental protection
Platform extension services including die repackaging, interposer fabrication, and IC resurrection

Benefits

Wafer bank supply assurance protects long-running programs from memory IC supply disruption when original sources exit the market
Broad memory type coverage reduces the number of qualified suppliers needed across a system memory bill of materials
QML qualification provides the traceability and process documentation defense programs require
Custom SCD screening allows reliability assurance to be balanced with program cost and schedule
Platform extension services provide supply paths for legacy memory types beyond commercial end-of-life
DOD DMEA Trusted Supplier status provides procurement confidence for defense program memory sourcing

Applications

Defense avionics and guidance systems dependent on specific qualified memory types for long platform lifetimes
Radar and electronic warfare signal processors requiring high-reliability SRAM and FIFO buffer memory
Launch vehicle guidance and control systems requiring qualified, hermetically packaged memory devices
Military platform sustainment programs requiring legacy memory IC supply through wafer bank inventory
Ground-based defense and command systems requiring long-service-life qualified memory components
High-reliability industrial applications requiring long-duration qualified memory with documented traceability

Specifications

Memory types: SRAM, PROM, CBRAM, DDR, FIFO, MCM (multi-chip memory module)
Qualification levels: MIL-PRF-38535 Class B/Q, MIL-STD-883; custom SCD available
Packaging: Hermetic ceramic; plastic encapsulated; bare die and MCM formats available
Supply model: Standard catalog, wafer bank inventory, and platform extension sourcing
Platform extension: Die repackaging, interposer fabrication, and IC resurrection for legacy devices
Certifications: AS9100C, ISO 9001:2015, ITAR Registered, DOD DMEA Trusted Supplier

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FAQ

What memory IC types does the Teledyne HiRel portfolio cover?

• SRAM, PROM, CBRAM, DDR, FIFO, and MCM types address program code storage, data buffering, configuration memory, and high-speed data processing functions.

• Contact Teledyne HiRel for availability and qualification status of specific part numbers.

How does Teledyne HiRel ensure long-term supply of legacy memory ICs?

• An active wafer bank acquires inventory from manufacturers exiting the market and stores it for future program supply.

• The platform extension model commits to continued availability of key military memory parts beyond commercial end-of-life.

• Platform extension services including die repackaging and IC resurrection provide paths when wafer bank inventory is exhausted.

What radiation tolerance data is available for memory ICs?

• TID test data is available for applicable space-grade products and supports radiation assurance documentation.

• Custom radiation test steps can be incorporated into SCD-based qualification flows for specific mission environments.

What qualification standards apply to Teledyne HiRel memory ICs?

• MIL-PRF-38535 Class B, Q, and V and MIL-STD-883 qualification available.

• Space COTS for commercial space programs; custom SCD flows for program-specific requirements.

What is CBRAM and why is it used in space applications?

• CBRAM (Conductive-Bridging RAM) is non-volatile memory storing data by forming and dissolving conductive filaments in a solid electrolyte.

• Low power consumption and non-volatility make it suited for configuration and parameter storage in space systems.

• Radiation characteristics are evaluated under the applicable qualification and TID test program.

What packaging options are available for memory ICs?

• Hermetic ceramic for space and high-reliability defense applications requiring outgassing control.

• Plastic encapsulated for cost-sensitive or commercial space applications.

• Bare die and MCM formats for compact hybrid memory subsystem integration.

Can Teledyne HiRel source or resurrect specific legacy memory ICs?

• Platform extension services include wafer bank sourcing, die repackaging, and interposer fabrication to fit legacy footprints.

• IC resurrection -- redesigning parts and fabricating new wafers -- is available when wafer bank inventory is exhausted.

• Contact the Teledyne HiRel applications team to discuss specific legacy memory sourcing requirements.

What is the difference between Space COTS and QML-V for memory ICs?

• Space COTS is cost-effective for programs with shorter missions or lower radiation exposure requirements.

• QML-V (Class V) is the highest tier with hermetic packaging, full QML compliance, and the most extensive screening.

• Teledyne HiRel can advise on qualification tier selection based on mission duration, radiation environment, and program budget.

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High-Reliability Memory IC Technology Overview

Memory ICs in space and defense applications must satisfy requirements that commercial devices are not designed to meet: radiation tolerance over mission lifetime TID, operation across wide temperature ranges, hermetic packaging for vacuum environments, and long-term supply for programs running 20 or more years.

Memory Type Selection Guide

• SRAM: volatile high-speed memory for processor scratchpad, cache, and data buffering; fast read/write; requires continuous power

• PROM: one-time programmable non-volatile for program code and configuration; data retained without power

• CBRAM: non-volatile resistive memory with low power; suited for configuration and parameter storage

• DDR: synchronous DRAM for high-bandwidth data in on-board computers and signal processors

• FIFO: first-in first-out buffer for data rate matching in telemetry and data handling architectures

• MCM: multi-chip memory module combining multiple memory die in a compact integrated package

Radiation Effects on Memory ICs

• Total Ionizing Dose: cumulative dose shifts transistor threshold voltages and increases leakage in CMOS memory

• Single Event Upsets: energetic particles can flip memory bits; EDAC in system design addresses this

• Single Event Latch-up: bulk CMOS structures susceptible; hermetic packaging and rad-hard designs reduce risk

• Single Event Functional Interrupt: can corrupt memory controller state; recovered by power cycling or reset

Memory Supply Chain Considerations for Long-Duration Programs

For defense platforms expected to operate 15-30 years, memory IC supply assurance must be addressed at the design stage. Identifying critical memory devices early and engaging Teledyne HiRel's wafer bank and platform extension services provides the supply continuity defense programs require.

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